| 发明名称 |
SUBSTRATE SHEET MATERIAL FOR SEMICONDUCTOR AND MANUFACTURING METHOD THEREFOR, AND MOLDING METHOD USING THE SUBSTRATE SHEET MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate sheet material wherein warpage generating in the substrate sheet material can be suppressed even when all substrates formed in one sheet of the substrate sheet material are molded at the same time. <P>SOLUTION: A circular substrate sheet 10 is used to form a plurality of substrates 11 for a semiconductor package at the same time. Semiconductor chips 12 are mounted onto the respective substrates 11. The semiconductor chips 12 are molded by resin at the same time to form a semiconductor package, and the semiconductor package is divided into pieces. <P>COPYRIGHT: (C)2004,JPO |
| 申请公布号 |
JP2004179345(A) |
申请公布日期 |
2004.06.24 |
| 申请号 |
JP20020342964 |
申请日期 |
2002.11.26 |
| 申请人 |
FUJITSU LTD |
发明人 |
MEGURO KOICHI;NISHINO TORU;HAYASAKA NOBORU |
| 分类号 |
H01L21/48;H01L21/56;H01L23/31 |
主分类号 |
H01L21/48 |
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