| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipating structure for a printed circuit board, simplified in configuration and low in cost yet high in heat dissipating capability, and to provide a method for manufacturing the same. <P>SOLUTION: The heat dissipating structure for a printed circuit board 3 includes a circuit pattern for mounting an exothermic part 1 and a through hole 2 extending to the other surface provided at a location in the exothermic part mounting surface for mounting the exothermic part 1. The heat dissipating structure is built of a material higher in heat conductivity than the material that the printed circuit board 3 is built of, and a heat dissipating member 5 shaped insertable into the through hole 2 is installed in the through hole 2 with an adhesive member 4 in between the two. <P>COPYRIGHT: (C)2004,JPO |
