| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing, having flame retardance without containing halogen and antimony, having good moldability such as thermal curing property and excellent in reliability such as characteristics of holding at a high temperature. SOLUTION: The epoxy resin molding material for sealing comprises, as essential components, (A) an epoxy resin having≥2 epoxy groups in a molecule, (B) a compound having≥2 phenolic hydroxy groups in a molecule, (C) a cyclic phosphazene compound having, in the main chain skeleton, recurring units of formula (I) and/or formula (II) and (D) an inorganic filler, wherein the content of the (D) is≥70 wt.% based on the whole molding materials and an inorganic filler having flame retardant effect is contained in the (D). [wherein, m and n are each independently an integer of 1-10; R<SP>1</SP>to R<SP>6</SP>are a (substituted) 1-12C alkyl or aryl and may be the same as or different from each other; one or more of R<SP>1</SP>to R<SP>4</SP>has hydroxy; and A is a 1-4C alkylene or allylene.]. COPYRIGHT: (C)2004,JPO |
