发明名称 SUBSTRATE SURFACE TREATMENT PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate surface treatment processing apparatus for attaining excellent processing by adjusting a distance between a substrate and a nozzle plate in response to each of an ozone processing processes and a pure water processing process or the like in a processing tank. SOLUTION: The substrate surface treatment processing apparatus for performing chemical processing on the surface of the substrate 1 by chemicals including ozone and cleaning processing of the substrate 1 by a cleaning liquid is provided with a lower base 20 for pivotally supporting a support 22 for supporting the substrate 1 turnably, an upper base 10 placed at an upper part of the lower base 20 and vertically elevated / descended, and a nozzle plate 14 supported by the upper base 10 and extended on the substrate 1 to jet the chemicals and the cleaning liquid. The distance between the nozzle plate 14 and the substrate 1 is adjustable in response to the chemical processing or the cleaning processing by making either or both of the support 22 and the nozzle plate 14 supported by the upper base 10 and the lower base 20 vertically movable. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004179429(A) 申请公布日期 2004.06.24
申请号 JP20020344551 申请日期 2002.11.27
申请人 SHIMADA PHYS & CHEM IND CO LTD 发明人 ITO MITSUO;OMORI MASASHI
分类号 G03F7/42;B08B3/02;B08B3/08;B08B5/00;H01L21/027;H01L21/304;(IPC1-7):H01L21/304 主分类号 G03F7/42
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