| 发明名称 |
ABRASIVE CUSHION MATERIAL, DEVICE AND METHOD FOR WET-CHEMICAL GRINDING OF SUBSTRATE SURFACE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP process that brings about no dishing effect and which is free of variations in matter removal rate. <P>SOLUTION: The present invention relates to an abrasive cushion material and a process of a wet-chemical grinding of a substrate surface. The abrasive cushion consists of a polymer matrix having a specified water-solubility and the specified water-solubility is realized by non-polar or polar repeat units in the polymer. <P>COPYRIGHT: (C)2004,JPO |
| 申请公布号 |
JP2004179664(A) |
申请公布日期 |
2004.06.24 |
| 申请号 |
JP20030398516 |
申请日期 |
2003.11.28 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
GEYER STEFAN |
| 分类号 |
B24B37/00;B24D3/00;B24D3/28;B24D3/34;B24D7/18;B24D13/14;C08K3/22;C08K3/34;C08L101/00;H01L21/304 |
主分类号 |
B24B37/00 |
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代理人 |
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