| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily manage a change in characteristics of a light shielding film of a mask for exposure using an organic material as the light shielding film. <P>SOLUTION: Two kinds; a line pattern and a space pattern formed by a negative-to-positive reversal thereof are used as a dimensional inspection pattern to be used in a wafer process. <P>COPYRIGHT: (C)2004,JPO</p> |
