| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder connection structure and a method for solder-connecting by which a non-heat resistance electronic part can be surely soldered at a low cost. SOLUTION: A first solder part 14 made of tin-silver-copper based soldering material is respectively provided on a solder land 11 for surface mounting and a solder land 12 for lead terminal of a circuit board 10 wherein the lands 11 and 12 are formed on the same surface, and a terminal 21 of a chip-like electronic part 20 is mounted on the land 11 and it is heated to melt the first solder part 14 and connect it with the terminal 21. Next, a second solder part 15 made of tin-zinc based soldering material is provided on the first solder part 14 formed on the land 12, and a lead terminal 31 of a non-heat resistance electronic part 30 is inserted into a terminal hole 13 formed adjacent to the land 12, and then it is heated at lower temperature than the heating step to melt the second solder part 15 and connect it with the terminal 31. COPYRIGHT: (C)2004,JPO |
