PROCESS FOR MANUFACTURING INK JET HEAD UNIT AND INK JET HEAD UNIT

摘要

PROBLEM TO BE SOLVED: To complete the bonding of a base board and a cover in a short time while using a UV-curing adhesive. SOLUTION: The UV-curing adhesive 31 is applied to at least one bonding part 20a or 21a of a base board 20 provided with an ink jet head and its driver IC connected through a wiring pattern or a cover 21 being bonded to the base board 20 (step 2). The base board 20 and the cover 21 are then pasted together and the adhesive is projected from between the bonding parts 20a and 21a onto the surface of the base board 20 over the entire circumference at the bonding part (step 3). The projected adhesive 31 is irradiated with UV-rays only at the part 31a on the outside of the cover 21 thus curing only that part 31 (step 4). COPYRIGHT: (C)2004,JPO