| 摘要 |
PROBLEM TO BE SOLVED: To stably perform laser repair processings for a defective portion. SOLUTION: An image pickup device, in which a plurality of pixels, having pairs of semiconductor conversion elements that convert incident electromagnetic waves to an electrical signal and switching elements connected to the semiconductor conversion elements, are arranged in a matrix on a substrate, has a drive wiring 201 commonly connected to the plurality of switching elements arranged in one direction; and a signal wiring 203 commonly connected to the plurality of switching elements arranged in a different direction from the one direction; the switching element including a first semiconductor layer; and the semiconductor conversion element formed after the formation of the switching element and including a second semiconductor layer formed after forming the first semiconductor layer, wherein an electrode 9 of the semiconductor conversion element is formed, such that at least a part of area on the drive wiring 201 and at least a part of area on an electrode of the switching element are removed in a area where two of the drive wiring 201, the electrode of the switching element, and the signal wiring 203 are not overlapped with each other. COPYRIGHT: (C)2004,JPO
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