| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and the manufacturing method thereof wherein the wiring having no occurrence of the disconnections of its through conductors and its build-up wiring layers is made possible. SOLUTION: An insulating resin plate 1 is formed by laminating resin layers 1B, 1B on the top and bottom surfaces of a core body 1A made of a glass cloth impregnated with a resin which are decomposed by a laser beam more easily than the core body 1A. The wiring board is stuck on the top and bottom surfaces of the insulating resin plate 1 with wiring-conductor layers 2A, 2B comprising respectively copper foils 2A', 2B' coated with plating-conductor layers 13, 13. Further, the wiring board is provided with a plurality of through holes 3 formed by laser machining wherein they pass through the insulating resin plate 1 up down and their diameters are increased outward in the resin layers 1B, 1B. Moreover, the wiring board is provided with through conductors 4 formed by filling plating conductors in the through holes 3 as to connect with the wiring-conductor layers 2A, 2B of the top and bottom surfaces of the insulating resin plate 1. COPYRIGHT: (C)2004,JPO
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