发明名称 Printed circuit board with embedded capacitors and manufacturing method thereof
摘要 Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of B-stage.
申请公布号 US2004118602(A1) 申请公布日期 2004.06.24
申请号 US20030731246 申请日期 2003.12.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE SEOK-KYU;MIN BYOUNG-YOUL;JIN HYUN-JU;KANG JANG-KYU
分类号 H05K3/46;H05K1/16;H05K3/38;H05K3/42;(IPC1-7):H05K1/16;H05K7/06 主分类号 H05K3/46
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