发明名称 |
Etch thinning techniques for wafer-to-wafer vertical stacks |
摘要 |
Methods for thinning wafer-to-wafer vertical stacks in the fabrication of stacked microelectronic devices. The methods include etching away unsupported portions of a wafer to be thinned in the vertical stack. The removal of the unsupported portions substantially eliminates potential cracking and chipping of the wafer, which can occur during the thinning process when the unsupported portions exist.
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申请公布号 |
US2004118806(A1) |
申请公布日期 |
2004.06.24 |
申请号 |
US20020328958 |
申请日期 |
2002.12.24 |
申请人 |
KIM SARAH E.;LIST R. SCOTT |
发明人 |
KIM SARAH E.;LIST R. SCOTT |
分类号 |
H01L21/20;H01L21/306;H01L25/065;(IPC1-7):H01B13/00 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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