| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film sticking apparatus which enables the accurate cutting of a film, also enables the removal of chips, and prevents the chips from being captured when a film body is stuck on a substrate. <P>SOLUTION: This film sticking apparatus for sticking the film body on a desired area of each of the substrates by using the stickiness of the film body is provided with: a film cutting means 6 which is equipped with a cutter 7 for cutting the film body in a part corresponding to a part between the substrates of the film body 2c of the film 2 paid out from a film roll 1 and a part corresponding to a part where the substrate is not desired to be stuck on the film body, in the width direction of the film body, by moving the film body in the width direction of the film body; a holding means 5 which is located on the other side of the cutter by locating the film in a central position, so as to make a base film 2b attached by suction when the film body is cut with the cutter in the width direction of the film body; and a suction means which is located in the rear of the movement of the cutter 7 with respect to the film body so as to move with the cutter 7. <P>COPYRIGHT: (C)2004,JPO</p> |
