| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a device that has corrected the distortion in formed images produced because of the use of a reflective mask having a thick absorbing layer and inclined lighting in a lithography device that uses extreme ultraviolet rays as projection beams. <P>SOLUTION: The distortion induced by the reflective mask (MA), on the absorbing layer of which a mask pattern has been embodied, and the inclined lighting is calculated and aberration in a projection system (PL) is introduced and/or controlled in order to correct the distortion. Since this can be done by the control of the optical elements already present in the projection system (MA), there is no need to modify the device. In Zernike polynomial, it is desirable that the aberrations described above are Z2 (inclination of X), Z3 (inclination of Y), or Z7 (frame X). <P>COPYRIGHT: (C)2004,JPO</p> |
