| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low-temperature (lower than about 225°C) polyimide-based adhesive composition suitable for electronic applications (multilayered flexible circuits, rigid-flex circuits, and chip scale packagings). <P>SOLUTION: The polyimide adhesive composition, comprising a polyamide-based polymer synthesized by bringing an aromatic acid dianhydride into contact with a diamine component, is characterized in that the above diamine component comprises about 50-about 90 mole% aliphatic diamine and about 10-about 50 mole% aromatic diamine and that the above polyimide-based polymer has glass transition temperatures of from about 150, 160, 170, 180 or 185°C to about 190, 195, 197 or 200°C. <P>COPYRIGHT: (C)2004,JPO</p> |
