WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which can effectively stop underfill materials from spreading without increasing parts in number and its cost and can be improved in mounting density and reliability.

SOLUTION: The wiring board 11 is equipped with a wiring board main body 12 with a first main surface 13 and a second main surface 14. An electronic part mounting region 15 where an electronic part 16 is mounted is set up on the first main surface 13. A plurality of pads 23 to which the electronic part 16 is connected are arranged in the electronic part mounting region 15. The first main surface 13 and the second main surface 14 are coated with solder resists 21 and 22. A dam 71 is formed on the surface of the solder resist 21. The dam 71 has properties of easily repelling the underfill material 75 filling a gap between the electronic part 16 and the solder resist 21.

COPYRIGHT: (C)2004,JPO