| 摘要 |
PROBLEM TO BE SOLVED: To reduce cost damages even when a semiconductor chip becomes defective or has any other problems. SOLUTION: A semiconductor laser chip component 10 comprises the semiconductor laser chip 11, heat sink 13 whereon the semiconductor laser chip 11 is die-bonded, ball lens 14 which converts backward light 12 a emitted from the semiconductor laser chip 11 into parallel rays of light and is fastened to the heat sink 13, and electrode patterns 161 and 162 which are electrically connected to the semiconductor laser chip 11 and are formed on the heat sink 13. Parallel rays of light can be obtained from the semiconductor laser chip 11 by supplying power to the semiconductor laser chip component 10, and so the semiconductor laser chip 11 can be inspected for defects or any other problems before it is packaged. COPYRIGHT: (C)2004,JPO |
