| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can easily be mounted on a substrate and its mounter. <P>SOLUTION: The semiconductor device (2) has a package body (4) including a semiconductor element and a plurality of lead wires (6) which are led out from at least two opposite sides of the package body (4). The package body (4) has one or more through holes (8), and the plurality of lead wires (6) are curved in the adjoining places of ends far from the package body (4). When the semiconductor device (2) is mounted on the substrate (10), the package body (4) and the substrate (10) are arranged opposite to each other and coupled together by making one or more screws (12) penetrate through holes (8) of the package body (4) and through holes bored in the substrate (10) to hold the package body (4) and the substrate (10) at a specified interval, thereby pressing the curved parts of the lead wires (6) against a wiring pattern (14) provided on the surface of the substrate (10). <P>COPYRIGHT: (C)2004,JPO</p> |
