| 摘要 |
A wire bonding BGA package. On a conductive metal layer of a substrate used for carrying a die, a power ring for providing an operating voltage to a core circuit of the die is disposed in the inner side of a power ring for providing an operating voltage to an input/output circuit of the die. When the die is packaged by flip chip packaging instead of wire bonding packaging, the power bailout assignment of the BGA package is unchanged and is suitable for matching with an original circuit board used for the wire bonding BGA package. In addition, the present invention provides a flip chip BGA package. When the die is packaged by wire bonding packaging instead of flip chip packaging, the power bailout assignment of the BGA package is unchanged and is suitable for matching with an original circuit board used for the flip chip BGA package.
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