| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of stabilizing the S shape of an inner lead after bonding. <P>SOLUTION: In a method of manufacturing of μBGA/IC 17, in which a chip 12 is adhered through an insulating film 10 to a tape carrier in which a plurality of inner leads 7 are laid on a main surface, and each electrode pad 14 of the chip 12 is bonded to each of inner leads 7, when the inner lead 7 is bonded to the electrode pad 14, first, the chip 12 is supplied to a predetermined position relative to a bonding tool by using a sprocket hole of the tape carrier, subsequently, the positions of the inner lead 7 and the electrode pad 14 are recognized by using a feature lead and the electrode pad. Then, the center line of the inner lead is recognized and the inner lead 7 is landed on the chip 12 by the bonding tool, and pushed in the direction to a base end and bent to the S shape. Thereafter, an end part of the inner lead 7 is thermocompression bonded to the electrode pad 14 by the bonding tool. <P>COPYRIGHT: (C)2004,JPO |
