| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve abrasion resistance, writability, heat resistance, waterproofness, and durability of a card. <P>SOLUTION: In this IC card, an IC module having an IC chip 3a2 and an antenna 3a1 is arranged between a first sheet material 1 and a second sheet material 2 via adhesive layers 6 and 7. In the IC card, a writing layer 9a is arranged on at least one face side of the first sheet material 1 and the second sheet material 2. The writing layer 9a contains resin, wax, and fiber/needle type filler. <P>COPYRIGHT: (C)2004,JPO |
