| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosetting resin composition capable of forming a hardened film with high performance and superior properties such as heat resistance, moist heat resistance, adhesiveness, mechanical property and electric insulation, and being suitable for manufacturing a printed circuit board, a high density multi-layer board and a semiconductor package, etc., and provide a photosensitive element capable of forming a hardened film with superior properties such as heat resistance, moist heat resistance, adhesiveness, mechanical property and electric insulation by laminating the layer of the photosetting resin composition onto a support. <P>SOLUTION: The photosetting resin composition includes an epoxy resin (A) containing an acid-modified vinyl group, an elastomer (B), a photopolymerization initiator (C), a diluent (D) and a hardener (E) as indispensable components. The hardened film of the composition has an elastic modulus of 1-100 MPa in the measurement of dynamic viscoelasticity in the region of 200-220°C. The photosensitive element is formed by laminating the layer of the photosetting resin composition onto the support. <P>COPYRIGHT: (C)2004,JPO |
