| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin sealing device which prevents a defect such as a void or a wire deformation from occurring during sealing a chip mounted on a substrate with a resin and uses a resin material effectively. <P>SOLUTION: A bottom force 1 is equipped with a cavity 5, a gas flow path 7 communicating with the cavity 5 and a heater 8. A top force 2 is equipped with a substrate mounting part 11 on which the substrate 14 is mounted and a gas flow path 13 which sucks the substrate 14. The chip 15 is mounted on the main face of the substrate 14 and the electrodes of the substrate 14 and the chip 15 are connected together by means of a wire 16. In addition, a conveying unit 3 for conveying a resin material 4 is installed between the bottom force 1 and the top force 2 in a freely advancing/receding manner. The resin material 4 is stamped to the size and shape of the cavity 5 and thermally melted into a molten resin 17 using a heater 8 after being arranged in the cavity 15. Next, the chip 15 and the wire 16 are soaked in the molten resin 17 after clamping the mold while the cavity 5 is decompressed by the gas flow path 7 and a molded object is formed by curing the molten resin 17. <P>COPYRIGHT: (C)2004,JPO</p> |
