| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition excellent in dynamic physical properties, dimensional stability, heat resistance, flame retardant property, etc., especially in high temperature physical properties, and a material for a substrate, a sheet, a laminated plate, a copper foil with the resin, a coppr plated laminated plate, a tape for an TAB, a printed substrate, a prepreg and an adhesive sheet. SOLUTION: This resin composition contains 100pts.wt. thermosetting resin with 0.1-65 pts.wt. inorganic compound, and has≤17×10<SP>-5</SP>[°C<SP>-1</SP>] mean linear expansion coefficient (α2) from 10°C higher temperature from the glass transition temperature of the resin composition to 50°C higher temperature from the glass transition temperature of the resin composition. COPYRIGHT: (C)2004,JPO |
