发明名称 APPARATUS AND METHOD FOR SOLDERING
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method for soldering which can enhance reliability in mounting a component. SOLUTION: The apparatus 1 for soldering for mounting a connector 3 on a printed board 66 includes a nozzle assembly 2 having a plurality of nozzles 4 each for injecting a hot air H to soldering parts A, B having two different types of the amounts of the solders. The nozzles 4 have a plurality of main nozzles 4a, 4b each for injecting the hot air H to the soldering parts A, B, and a sub-nozzle 4c disposed near the main nozzle 4b for injecting the hot air H to the soldering part B having more amount of the solder of these main nozzles 4a, 4b. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004179401(A) 申请公布日期 2004.06.24
申请号 JP20020343959 申请日期 2002.11.27
申请人 SEIKO EPSON CORP 发明人 KOSEKI AKIMITSU
分类号 B23K3/04;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K3/04
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