发明名称 CUTTING APPARATUS FOR SEMIPLASTIC BODY
摘要 PROBLEM TO BE SOLVED: To provide a cutting apparatus which enables a semiplastic body to be smoothly and properly cut by eliminating poor cutting caused by the bending and curling of a cutting wire, through the use of a simple constitution. SOLUTION: This cutting apparatus for the semiplastic body is equipped with a pair of winding drums 2a and 2b with a diameter of 30 mm or more, which are arranged almost in parallel with each other; the cutting wires W, both the ends of which are wound around both the winding drums; driving means 4-8 for rotatively driving both the winding drums; and a tension unit 30 for imparting a prescribed tensile force to each of the wires. Each of the wires W is traveled and moved from one winding drum to the other winding drum in a state wherein the prescribed tensile force is imparted to each of the wires by the tension unit; the semiplastic body P is relatively moved at a prescribed speed with respect to each of the wires, so as to be cut off; and a high-strength fiber is used as the cutting wire W. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004175057(A) 申请公布日期 2004.06.24
申请号 JP20020346901 申请日期 2002.11.29
申请人 SUMITOMO KINZOKU KOZAN SIPOREX KK 发明人 NAKANO SHINSUKE;YAGI YOSHIKI
分类号 B28D1/08;(IPC1-7):B28D1/08 主分类号 B28D1/08
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