| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high resolution and high hold time characteristics after lamination or exposure and useful as a DFR for the manufacture of an alkali developing type printed circuit board, a lead frame and a semiconductor package. <P>SOLUTION: The photosensitive resin composition contains: (a) a binder resin by 20 to 90 mass% containing linear polymer having 100 to 600 carboxyl group content in terms of acid equivalents and 20,000 to 500,000 weight average molecular weight; (b) a photopolymerizable unsaturated compound by 3 to 70 mass%; (c) a photopolymerization initiator by 0.1 to 20 mass%; (d) aluminum N-nitrosophenylhydroxylamine by 0.001 to 3 mass%; and (e) a benzotriazol compound by 0.005 to 5 mass%. <P>COPYRIGHT: (C)2004,JPO |
