| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus that easily evaluates a removed film thickness after plasma processing in a short time. <P>SOLUTION: A shield plate 19 having a hole 20 is provided above a substrate 13 at a fixed interval, and an oxygen radical in plasma ashes resist on the substrate 13 through the hole 20; and an irradiated part is mainly an opening part of the hole 20, and the part of the outermost shell circumference ashed by the irradiation is sectioned as if a film were obliquely digged, so the film thickness can be estimated with the number of rings of interference fringes viewed on the top surface of the film. <P>COPYRIGHT: (C)2004,JPO |
