| 摘要 |
PROBLEM TO BE SOLVED: To simplify a manufacturing process of the so-called chip size package (CSP) semiconductor device having rewiring for transmission of a high frequency signal. SOLUTION: In order to simplify the manufacturing process, connecting pads 2, a ground layer 6 thereon via an insulating film, first to third rewinding 7, 8, and 9 thereon via a protecting film, and posts S<SB>0</SB>, S<SB>1</SB>, G, and D thereon are arranged on only the upper surface side of a silicon substrate 1. The first rewinding 7 is for transmission of the high frequency signal, and the dummy pad 7b and dummy post D for restraining attenuation of the high frequency signal are arranged on the way of the rewinding 7. In the ground layer 6 under the posts S<SB>0</SB>, D, opening parts for reducing stray capacitance are arranged. COPYRIGHT: (C)2004,JPO |
