| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device which prevents malfunctions of the solder bump bonding, improves bonding strength and is excellent in bonding reliability. SOLUTION: The top face and side faces of a pad electrode 30c made of an Al-Cu alloy formed on a piezoelectric substrate 20 are covered with an intermediate layer composed of a Cr layer 40a and a Ni layer 40b and a surface layer 40c made of Au, and a protective film 50 is arranged around the intermediate layer and the surface layer 40c. COPYRIGHT: (C)2004,JPO
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