| 摘要 |
A system includes plurality of aligned heat transfer structures in a thermal interface material (TIM) to transfer heat from a die to a heat sink. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem includes a plurality of aligned first heat transfer structures that are anisotropically and discretely disposed in a second heat transfer material. A method of bonding a die to a heat sink uses a die-referenced process as opposed to a substrate-referenced process.
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