Creating hermetically sealed, dielectrically isolating trenches for mechanical-electrical sensor structures involves sealing hollows formed when filling by low-pressure deposition from widened regions

摘要

The method involves filling with a deposition process, whereby the trenches are slightly widened at defined positions and a low pressure deposition method is used so that hollow chamber channels formed when filling in the region of the normal width trench by closing the upper trench region with a filler material (9) are hermetically sealed by low-pressure deposition from the widened region in the longitudinal trench direction. Independent claims are also included for the following: (a) an arrangement manufactured in accordance with the inventive method (b) and a device with a wafer with trenches .