发明名称 BUNDLING MOUTH FOR LEAD WIRE
摘要 <P>PROBLEM TO BE SOLVED: To provide a bundling mouth for a lead wire, which can be simply manufactured by punching processing, with a simple structure, with less manufacturing costs, and with easy installation work. <P>SOLUTION: The bundling mouth for the lead wire includes at least one of bundling pieces 61, 62 to which receiving holes 61a, 62a capable of receiving a plurality of the lead wires in a bundle and slit parts 61b, 62b formed so as to be extended from the receiving holes 61a, 62a to their outside parts are formed. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004180485(A) 申请公布日期 2004.06.24
申请号 JP20030073760 申请日期 2003.03.18
申请人 SAMSUNG KWANGJU ELECTRONICS CO LTD 发明人 CHA HYUN-ROK
分类号 H02G3/30;H02G3/32 主分类号 H02G3/30
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