发明名称 CERAMIC MULTILAYERED BOARD AND MANUFACTURING METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a ceramic multilayered board and a manufacturing method therefor that make connection between an external terminal and an inside patterned layer more stable and usually maintain the connection even when an error in a manufacturing process occurs. <P>SOLUTION: The ceramic multilayered board and the manufacturing method therefor include a plurality of ceramic substrates 210 multilayer-formed at a fixed thickness; patterned layers 230 making circuit elements formed on the surface of the ceramic substrates 210; external terminals 220 formed on the outside surfaces of a plurality of the layered ceramic substrates 210; and inside connection portions which is formed at parts in the patterned layers 230, connected to the external terminals 220 so as to exchange signals with an outside, and widely formed so as to cover the external terminals. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004179602(A) 申请公布日期 2004.06.24
申请号 JP20020378962 申请日期 2002.12.27
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 JUN SEOK TAEK;MOON MYOUNG LIP;LEE DUK WOO
分类号 H05K1/11;H01L23/498;H05K1/03;H05K3/00;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/11
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