| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition, a material for substrate, a sheet, a laminate, a resin-coated copper foil, a copper-clad laminate, a tape for TAB, a printed circuit board, a prepreg and an adhesive sheet, which are excellent in mechanical properties, dimensional stability, heat resistance, flame retardancy, etc., and in particular excellent in physical properties at a high temperature. SOLUTION: The resin composition comprises 100 pts.wt. thermoplastic resin and 0.1-65 pts.wt. inorganic compound, and is characterized in that the average coefficient (α2) of the linear expansion from the temperature 10°C higher than the glass transition temperature of the resin composition to the temperature 50°C higher than the glass transition temperature of the resin composition is 1.0×10<SP>-3</SP>[°C<SP>-1</SP>] or less. COPYRIGHT: (C)2004,JPO
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