发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device in which the area occupied by a peripheral circuit with respect to one pixel region is decreased, and to provide a method for manufacturing the device. SOLUTION: The semiconductor device has a pixel region 1, peripheral circuit regions 2a to 2c disposed in at least a part of the periphery of the above pixel, and wiring formed in the peripheral circuit regions, and the wiring consists of multilayer wiring having two or more layers. At least one layer of the wiring in the multilayer wiring is made of a low resistance material. A transistor is fabricated in the peripheral circuit regions, and the multilayer wiring having two or more layers is formed above the transistor. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004177892(A) 申请公布日期 2004.06.24
申请号 JP20020347320 申请日期 2002.11.29
申请人 SEMICONDUCTOR ENERGY LAB CO LTD;SHARP CORP 发明人 ISHIKAWA AKIRA;FUKUSHIMA YASUMORI
分类号 G02F1/1368;G02F1/1345;G02F1/1362;H01L21/3205;H01L21/768;H01L21/77;H01L21/84;H01L23/52;H01L27/12;H01L29/786;(IPC1-7):G02F1/136;G02F1/134;H01L21/320 主分类号 G02F1/1368
代理机构 代理人
主权项
地址
您可能感兴趣的专利