| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate fixing method and a substrate fixing apparatus for flatly fixing each substrate having variation in the position and size of warpage onto a stage, a printing apparatus provided with the substrate fixing apparatus, and a method for manufacturing a display such as an organic EL apparatus, a liquid crystal display, and a plasma display, by using the substrate fixing method. SOLUTION: A plurality of suction holes 11 and a plurality of voids 19 are provided on the stage in advance. Then, a suction unit 29 inserted into each void 19 is allowed to rise (to move in a first direction) for sucking the substrate 1 on the state 10. After that, each suction pad 21 is lowered (is moved in a direction opposite to the first direction) for allowing the substrate 1 to come into contact with the stage 10 and then the substrate 1 is fixed by each suction hole 11. COPYRIGHT: (C)2004,JPO |
