发明名称 Printed circuit board with embedded capacitors therein, and process for manufacturing the same
摘要 Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
申请公布号 US2004121266(A1) 申请公布日期 2004.06.24
申请号 US20030728591 申请日期 2003.12.04
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE SEOK-KYU;MIN BYOUNG-YOUL;NAM CHANG-HYUN;JIN HYUN-JU;KANG JANG-KYU
分类号 H05K3/46;H05K1/16;(IPC1-7):G03F7/00 主分类号 H05K3/46
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