发明名称 |
Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
摘要 |
Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
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申请公布号 |
US2004121266(A1) |
申请公布日期 |
2004.06.24 |
申请号 |
US20030728591 |
申请日期 |
2003.12.04 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE SEOK-KYU;MIN BYOUNG-YOUL;NAM CHANG-HYUN;JIN HYUN-JU;KANG JANG-KYU |
分类号 |
H05K3/46;H05K1/16;(IPC1-7):G03F7/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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