| 摘要 |
PROBLEM TO BE SOLVED: To solve the difficulty that in an electrostatic chuck a large residual attraction force causes to damage a wafer W when the wafer W is peeled off from the electrostatic chuck or many particles are produced on the back of the wafer W. SOLUTION: There are provided a placement face 3 on one principal surface of a plate-shaped ceramics structure 2 for holding the wafer W, and an attraction electrode 4 inside the plate-shaped ceramics structure 2 or on the other principal surface of the same. Further, the attraction electrode 4 is formed to provide a protruded face with respect to the placement face 3, thereby arranging the thickness of an insulating layer 5 formed between the attraction electrode 4 and the placement face 3 thinner at a central portion than at an outer peripheral part. COPYRIGHT: (C)2004,JPO |
