MULTICHIP MODULE

摘要

PROBLEM TO BE SOLVED: To provide a miniaturized multichip module while high performance is realized.

SOLUTION: A plurality of first semiconductor chips transferring signals are disposed on a surface of a loaded substrate. A second semiconductor chip where most bonding pads are arranged back to back with at least one of a plurality of the first semiconductor chips along one side is loaded. The bonding pad is wire-bonded with a corresponding electrode formed on the loaded substrate. The first and the second chips and a bonding wire on the loaded substrate are sealed with a sealing body.

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