| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition improved in impact resistance, thermal cracking resistance, oxidation deterioration resistance, and thermal deterioration resistance without detriment to heat resistance typified by HDT (thermal deformation temp.) and being desirable for sealing e.g., semiconductors. SOLUTION: This thermosetting resin composition comprises (A) a thermosetting resin, (B) a liquid monoolefin polymer selected from among (a) a liquid monoolefin polymer containing at least one epoxy group, (b) a liquid monoolefin polymer containing at least one aldehyde group, and (c) a liquid monoolefin polymer containing at least one ketone group, and (C) an organometallic compound and/or a metal ester compound. COPYRIGHT: (C)2004,JPO
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