| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which prevents the occurrence of a shorting in a circuit due to a metal bur which occurs at the time of cutting work, in which damage such as a chip and a crack does not occur in a mother board, a metallized wiring layer and an insulating layer by cutting work and which can highly reliably and efficiently be manufactured, and to provide a manufacturing method of the circuit board. SOLUTION: In the circuit board 5, the metallized wiring layer 2, the insulating layer 3 laminated over a whole periphery of a main face of the insulating substrate and the outer peripheral edge of the insulating substrate of the metallized wiring layer 2, and a metal plated layer 4 adhered to a part except for the insulating layer 3 on the metallized wiring layer 2, are formed on the main face of the insulating substrate formed of ceramic. Sides of the insulating substrate, the metallized wiring layer 2 and the insulating layer 3 are cutting faces cut by a cutting blade. When the thickness of the insulating layer 3 is set to be T, the width to be W and the thickness of the metallized wiring layer 2 to be (t), it becomes t≤T≤W. COPYRIGHT: (C)2004,JPO
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