| 摘要 |
PROBLEM TO BE SOLVED: To provide a black composite particle powder for a semiconductor sealing material of low moisture content, with high moisture resistance, black level, and coloring performance while fluidity and dispersing property in binding agent resin are excellent, and to provide the semiconductor sealing material of high volume-intrinsic resistance value, with excellent black level, heat-resistance of solder, fluidity, and bending strength by using the black composite particle powder for the semiconductor sealing material. SOLUTION: The black composite particle powder for the semiconductor sealing material comprises the black composite particle powder in which the particle surface of extender is covered with a paste agent, with a black pigment sticking to the cover. The voluminal average particle size of the black composite particle powder (D<SB>50</SB>) is 0.05-15.0μm, voluminal maximum particle size (D<SB>99</SB>) is 20μm or less, and standard deviation value of the voluminal particle size is 2.00 or less. The semiconductor sealing material contains the black composite particle powder and the binding agent resin. COPYRIGHT: (C)2004,JPO
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