发明名称 Method for fabricating a gold contact on a microswitch
摘要 Described is a process to pattern adhesion and top contact layers in such a way that at least some portion of the top contact layers overlaps the adhesion layer, while another portion of the top contact layer overlaps with the bottom contacts, but does not overlap with the adhesion layer. The overlap between the top contact layer and the adhesion layer helps to hold the top contact layer onto the sacrificial layer. Because there is no overlap between the adhesion layer and the bottom contact, the removal of adhesion layer is no longer necessary, leading to better contacts and simplifying the fabrication process.
申请公布号 US2004121505(A1) 申请公布日期 2004.06.24
申请号 US20030673546 申请日期 2003.09.30
申请人 MAGFUSION, INC. 发明人 TAM GORDON;SHEN JUN
分类号 H01H50/00;(IPC1-7):H01L21/00;H01L21/44 主分类号 H01H50/00
代理机构 代理人
主权项
地址