| 摘要 |
An electrostatic chuck support mechanism is disclosed. An electrostatic chuck plate is fixed to a support stand by hold-down fittings, whereby a plug in a lower end portion of a copper pipe is fitted into a fitting socket against the pushing-up force of a jump-up fitting relying on a compression spring member. When the fixing of the electrostatic chuck plate is released from the support stand, the plug of the copper pipe is pushed up by the pushing-up force of the jump-up fitting relying on the compression spring member to move the copper pipe upward along with the electrostatic chuck plate. The electrostatic chuck support mechanism so constructed enables the electrostatic chuck plate to be mounted and detached easily.
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