| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive paste with which the change in pattern sizes before and after baking is little and the manufacture of partitions is possible. <P>SOLUTION: The photosensitive paste is characterized by including the following (1) to (4): (1) The photosensitive paste contains an alkali-soluble polyorganosiloxane resin composition and inorganic particles. (2) Boric acid or its derivative is incorporated in the photosensitive paste. (3) A compound which generates an acid by electromagnetic waves or heat is incorporated therein and the above boric acid or its derivative and the compound which generates the acid by the electromagnetic waves or heat are incorporated therein. (4) The alkali-soluble polyorganosiloxane resin composition contains the following (A) and (B): (A) is the polyorganosiloxane resin containing at least one functional group which is a specific functional group and (B) is the polyorganosiloxane resin having a hydroxyl group. <P>COPYRIGHT: (C)2004,JPO |
