| 发明名称 |
METHOD AND FACILITY FOR IMPROVING GROUND |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce time and labor required for the work to improve the ground. <P>SOLUTION: A material (14) and a discharge electrode (16) helpful for improving the ground (10) are arranged in the ground and a plasma is generated at the surroundings of the discharge electrode by impression of a voltage to the discharge electrode. A facility for improving the ground includes a hole (18) disposed at the ground and the material (14) and discharge electrode (16) helpful for improving the ground arranged in the hole. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2004174330(A) |
申请公布日期 |
2004.06.24 |
| 申请号 |
JP20020341383 |
申请日期 |
2002.11.25 |
| 申请人 |
KUMAGAI GUMI CO LTD;SUMITOMO ELECTRIC IND LTD;OKUMURA ENGINEERING CORP |
发明人 |
KAKIUCHI YUKIO;KITAHARA SHIGEO;OKAZAKI TORU;TAKEGAKI YOSHIKATSU;YOSHIHARA NORIAKI |
| 分类号 |
E02D3/11;A62D3/19;A62D3/37;A62D101/22;A62D101/43;A62D101/45;B09C1/00;B09C1/02;B09C1/04;B09C1/08;(IPC1-7):B09C1/02;A62D3/00 |
主分类号 |
E02D3/11 |
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