发明名称 COMPONENT JOINING METHOD AND STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a component joining method and structure which restrains the production of an oxide film in joining components with a metal liable to oxidize and enables stable joining of high quality. SOLUTION: In a method of joining components with a soldering material, a solder layer 5 is formed on the surface to be joined of the component 1 and an antioxidant coat 6 is formed on the surface of the solder layer. The component 1 is made to touch the component 2 to be joined, through the solder layer and the antioxidant coat and, is heated so that the component 1 is joined to the component 2 to be joined, through the antioxidant coat. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004174594(A) 申请公布日期 2004.06.24
申请号 JP20020347143 申请日期 2002.11.29
申请人 TOPCON CORP 发明人 MOMIUCHI MASAYUKI;GOTO YOSHIAKI;KONO TAIZO
分类号 B23K1/20;B23K101/36;H01L21/52;H01L21/60;H01L23/40;H01R4/02;H01R43/02;(IPC1-7):B23K1/20 主分类号 B23K1/20
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