| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board with a solder bump wherein the amount of solder of any solder bump is uniform, and an electrode of electronic parts and a soldering pad are strongly joined through the solder bump. SOLUTION: Printing is performed by the use of a printing mask having bump forming openings 5a formed in a lattice array at positions corresponding to soldering pads 3 and dummy openings 5b formed substantially in the same configuration as that of the bump forming openings 5a and the same arrangement interval as that of the same outside the arrangement of the bump forming openings 5a. Consequently, bump forming solder paste 6 is printed and applied on the soldering pads 3 with the dummy solder paste 7 printed and applied on a resistant resin layer 4 outside the soldering pads 3. Thereafter, solder fractions in these solder pastes 6, 7 are heated and melted to form the solder bump 8 joined with the soldering pads 3, and further form a solder ball 9 on the solder resistant resin layer 4 extending outside the soldering pads 3. Finally, the solder ball 9 is removed. COPYRIGHT: (C)2004,JPO
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