发明名称 Heat-dissipating device
摘要 The invention discloses an annular heat-dissipating device formed by a plurality of fins combined together, all of which are arranged around a base, wherein one side of each of the plurality of fins is coupled to the base, respectively. The heat-dissipating device of the invention can greatly increase the heat-dissipating area so as to effectively dissipate heat generated from the electronic elements to the outside.
申请公布号 US2004118552(A1) 申请公布日期 2004.06.24
申请号 US20030391084 申请日期 2003.03.17
申请人 HUANG WEN-SHI;LIN KUO-CHENG;TAN LI-KUANG;HUANG YU-HUNG 发明人 HUANG WEN-SHI;LIN KUO-CHENG;TAN LI-KUANG;HUANG YU-HUNG
分类号 F28F3/02;H01L23/367;H01L23/467;(IPC1-7):F28F7/00 主分类号 F28F3/02
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